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We have decades of experience meeting the stringent regulations and certifications for the automotive, aerospace and medical device industries, which serve as benchmarks for all of the products we manufacture.

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Flexible Hybrid Electronics (FHE) combine the flexibility and low cost of printed conductive circuits, interconnects, antennas, and sensors with the complex capabilities and extreme malleability of integrated circuits.

This innovative process allows us to create a uniquely resistant solution that is highly bendable and adaptable to several types of shapes and situations. As a result, they can incorporate into many new and emerging consumer, medical and industrial products and deliver on the promise of manufacturing electronics in higher volume and at lower costs.

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FHEs can be used in a variety of components and devices, including:

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By combining flexible and rigid components, this hybrid approach offers several advantages that cannot be achieved by either of the traditional methods on their own, including:

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One of the options ALMAX uses to mount components on FHEs is the use of conductive adhesives and epoxys. This replaces the need to mount components with solder reflow like traditional rigid circuit boards do. For basic implementations such as passives and components with simple pinouts, ALMAX uses Isotropic Conductive Adhesives (ICAs) which are capable of conducting in all directions. Anisotropic Conducting Adhesives (ACAs) are used for more advanced implementations, please contact us for more information.

Conductive Adhesives for Flexible Hybrid Electronics
Low Temperature Solder for Flexible Hybrid Electronics

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While we generally recommend sticking with conductive adhesives which are more stable, an alternative on some applications may require the use of a low-temperature solder. Although, more innovative approaches for low temp solders are still under development which may make this a more applicable choice in the future.

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For advanced Flexible Hybrid Electronics, Thinned Silicone Wafers are used to create thinned silicon dies that are complex in function, but still flexible enough to support the bendability needed for flexible circuits and wearables. Every year the research and development of this process continues to advance and allow for thinner and thinner levels of integration into the flexible circuit world.

Thinned Silicone Dies for Flexible Hybrid Electronics

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ALMAX provides top tier manufacturing for a complete array of FHE technologies. From concept design to volume manufacturing, our partners entrust their custom FHE needs to our engineering and manufacturing teams. Our core competency resides in solving human interface challenges, and we recognized early on that of the many issues surrounding how FHE’s were manufactured, the only proper solution for FHE innovation to flourish required quality control across the entire FHE manufacturing process.

 

Within two decades, we have expanded our operations to own three manufacturing facilities, including a domestic prototype facility, and two off-shore manufacturing plants providing high volume production capabilities. ALMAX has the capacity to offer our clients exquisite, high-quality, high-functionality FHE’s due to our portfolio of facilities, processes and expert engineering for a plethora of industries.

ALMAX Manufacturing Facility

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